The Effect of Corrugations on Mechanical Sensitivity of Diaphragm for MEMS Capacitive Microphone

Abstract

In this paper the effect of corrugated diaphragm on performance of MEMS microphone is described. The corrugated diaphragm is modeled in order to improve the sensitivity of micromachined silicon acoustic sensor. Analytical analyzes have been carried out to derive mathematic expressions for the mechanical sensitivity and displacement of corrugated diaphragm with residual stress. It is shown that the mechanical sensitivity and displacement of diaphragm can be modeled using thin plate theory. The mechanical stress of corrugated diaphragm is calculated using mathematical model and its relationship to residual stress is expressed. The analytically result show that the mechanical sensitivity of diaphragm can be increased using corrugation. Because the corrugation can be reduce the effect of residual stress of diaphragm.