نمایش مختصر رکورد

dc.contributor.authorAvanessian, J.en_US
dc.date.accessioned1399-07-09T08:06:44Zfa_IR
dc.date.accessioned2020-09-30T08:06:44Z
dc.date.available1399-07-09T08:06:44Zfa_IR
dc.date.available2020-09-30T08:06:44Z
dc.date.issued1988-02-01en_US
dc.date.issued1366-11-12fa_IR
dc.identifier.citationAvanessian, J.. (1988). The Potentiodynamic Behavior of Copper in NaCI Solutions Studied by Auger and Photoelectron Spectroscopy. International Journal of Engineering, 1(1), 1-6.en_US
dc.identifier.issn1025-2495
dc.identifier.issn1735-9244
dc.identifier.urihttp://www.ije.ir/article_70971.html
dc.identifier.urihttps://iranjournals.nlai.ir/handle/123456789/335136
dc.description.abstractThe potentiodynamic behaviour of copper in brine solutions was studies. Auger and photo-electron spectroscopy were used together with electrochemical methods. It is demostrated that the passivation observed in potentiodynamic curves is due to a surface film formation on a copper electrode. It is concluded that this film must be copper (I) chloride in nature. Effect of different factors on potentiodynamic curves has also been investigated.en_US
dc.format.extent237
dc.format.mimetypeapplication/pdf
dc.languageEnglish
dc.language.isoen_US
dc.publisherMaterials and Energy Research Centeren_US
dc.relation.ispartofInternational Journal of Engineeringen_US
dc.titleThe Potentiodynamic Behavior of Copper in NaCI Solutions Studied by Auger and Photoelectron Spectroscopyen_US
dc.typeTexten_US
dc.contributor.department, Mercen_US
dc.citation.volume1
dc.citation.issue1
dc.citation.spage1
dc.citation.epage6


فایل‌های این مورد

Thumbnail

این مورد در مجموعه‌های زیر وجود دارد:

نمایش مختصر رکورد